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Again soldered not worth it; you’d be looking at sun CPU rate.
The sun rate covers a large majority [but not all] of sun risc CPUs which have gold caps on ceramic LGA chips (no pins),
and PGA SUN ceramics WITH pins and without a gold cap but WItH a spreader.

Ceramic gold cap bga chips will almost always go as sun.

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Can you tell for sure if they are socketed from this angle?

They are socketed. Use small flat screwdriver. Go around the perimeter, lifting a little at a time by slightly twisting the driver.

Therefore, it seems you're saying the solder blocks the AU recovery of the pins?
What if the pins are 1/4" long and solder only covers 1/16"? In the previous scenario, would it be best to cut off the solder coated 1/16"?

Yes. Start at the corner opposite the gold corner tab (opposite the y). Chips are designed to be lifted there first.
Motorola used HIF sockets, high insertion force, so it takes a bit more effort than most other’s of the time to get them out... or in.

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The vast majority of soldered ICs dating back to the mid 70s are BGA (ball grid array). Bga chips have no pins at all. A bga chip is much like flat packs and modern Intel CPUs. A pinless LGA chips is connected to the LGA via tiny solder balls.

There ARE soldered PGA (pins) cpus. These are called stub pin PGA chips. The pin grid array is built into the board via pin through mounting and soldered directly. They are relatively rare by comparison to the other types of processors.
Solder doesn’t affect the rate for stub pin CPUs. However the shorter length pins and difference in plating to base metal of the pins does require a lower valuation compared to their full length pin counterparts.

A stub pin Motorola will be worth around the value of an IBM/VIA gold cap chip.

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