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I’m trying real hard to justify a higher grad for you but I’m not seeing it.
Low telco is a real stretch here.
For everyone’s benefit let’s look at why:
This has a lot of small ICs. Real small. Unfortunately they’re single layer. Using larger size production.
There’s a few large modern ICs like the processor and controllers but that’s not enough to help any.
Here’s the question I assume you have in mind, and many others.
Gold.
I don’t see any evidence this is a sandwich (full layers) board at all. The old ring method is mo longer a guarantee since IEE and JEDIC made it clear they were dropping the standards conferences on it.
So let’s go by experience.
Each through (hole) is clearly gold. The larger open ones show us, though, that the throughs are plated, leading further to my belief that the core, if there is one, is probably copper or tin.
So we decide based on plating. Which we have learned on this site really doesn’t change things too much. So we look for quantity.
I opened the photos in another tab and started counting. There’s a lot of holes. So using my mental calculator, usually reliable.
My estimate here is about $2 in total gold when fully refined.
Add the ICs.
The high grade standard metals, there’s a nice concentration of actual ceramic resisters of the classic copper core type here
CMCs for palladium recovery.
Many jumps and relays, good tin borocarbide
the rare earths… etc etc
I think you have low telco, and only just barely.
This is the full mental break down process I use when looking at something outside the norm. Again, I’m human. So ultimately they will decide when they have it in hand.
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42 6F 61 72 64 73 6F 72 74 2E 63 6F 6D
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