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PostPosted: Tue Mar 10, 2026 1:57 pm 

Joined: Wed Feb 25, 2026 9:17 am
Posts: 2
Trying to figure out how this card would be classified for scrap (see pic).

If I remove the heatsink and bracket, would this count as a clean gold finger card?

I believe the capacitors need to come off also. If so, is cutting them off fine or do they need to be desoldered?

Or is this just considered a lower grade board no matter what?


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PostPosted: Tue Mar 10, 2026 2:42 pm 
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Joined: Mon Apr 15, 2024 9:38 pm
Posts: 341
I would just remove the bracket and the heat sink. Then submit as Gold Finger Card. As a consideration. Some individuals leave the bracket on and claim a better payout. Do a forum search. You will find the bracket issue addressed. Now. For me. I mail in. So. I need space in my box. The brackets take too much space up. They keep me from packing as tightly as possible. Being able to put a few more RAM or high priced CPU in my package does more to offset shipping costs than that bracket weight.
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My grade evaluations are my own opinion.


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PostPosted: Tue Mar 10, 2026 2:51 pm 

Joined: Sat Nov 29, 2014 9:44 pm
Posts: 1830
Location: I'm right here :D
No need to remove any components that are soldered on.

I prefer to take off heatsinks and brackets.

If that is covered in ICs the way it appears you may actually get a high Telco grade for it.

Do remember to utilize the What is it? section of the forum for help with grading.

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My grades are my own opinion and not an official grade from Boardsort


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PostPosted: Tue Mar 10, 2026 3:15 pm 

Joined: Wed Feb 25, 2026 9:17 am
Posts: 2
marked141 wrote:
No need to remove any components that are soldered on.

I prefer to take off heatsinks and brackets.

If that is covered in ICs the way it appears you may actually get a high Telco grade for it.

Do remember to utilize the What is it? section of the forum for help with grading.



It is a fusion io board

image attached without heat sync from a source google not identical but near same

https://en.wikipedia.org/wiki/Fusion-io


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