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Trying to figure out how this card would be classified for scrap (see pic).

If I remove the heatsink and bracket, would this count as a clean gold finger card?

I believe the capacitors need to come off also. If so, is cutting them off fine or do they need to be desoldered?

Or is this just considered a lower grade board no matter what?

I would just remove the bracket and the heat sink. Then submit as Gold Finger Card. As a consideration. Some individuals leave the bracket on and claim a better payout. Do a forum search. You will find the bracket issue addressed. Now. For me. I mail in. So. I need space in my box. The brackets take too much space up. They keep me from packing as tightly as possible. Being able to put a few more RAM or high priced CPU in my package does more to offset shipping costs than that bracket weight.
Here to learn like everybody else.
My grade evaluations are my own opinion.

No need to remove any components that are soldered on.

I prefer to take off heatsinks and brackets.

If that is covered in ICs the way it appears you may actually get a high Telco grade for it.

Do remember to utilize the What is it? section of the forum for help with grading.

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Here to learn more so I can recycle more
My grades are my own opinion and not an official grade from Boardsort

It is a fusion io board

image attached without heat sync from a source google not identical but near same

https://en.wikipedia.org/wiki/Fusion-io