This link may be helpful.
https://madpcb.com/glossary/chip-package/Yes. It is a type of flatpack. But it goes into the Boardsort IC chip category.
Another link.
https://boardsort.com/escrapforum/viewtopic.php?f=4&t=21797&hilit=FlatpackIt's easy to lose the forest for the trees.
You can technically call all integrated circuits in every way shape or form. DIE CHIPS..
Why? It goes back to the original manufacturing process. You would have a large number of ICs made on a large silicon wafer. Each indvidual IC was called a DIE Then diced the wafer apart and recover the individual DIE. The engineers call all those loose DIE. DIE CHIPS. The term stuck. Then you place the DIE in the type of package you want to carry it as in contain the DIE. The CHIP. The DIE CHIP. So you have all kinds of different packages. BGA. PGA. FLATPACK. DIP. And on and on and on. There are advantages and disadvantages to each package type. Now we refer to an integrated circuit by it's package type. It can get confusing.
But your picture is a type of flatpack. It goes into the Boardsort escrap category of IC Chips. It is not a BGA.
The terminology can get us lost. Its the gold bonding wire and any gold trace in them that gives value. View a few U-tube videos on IC manufacturing. You may find it interesting.
Here to learn like everybody else