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PostPosted: Wed Feb 26, 2025 11:44 am 

Joined: Sat Dec 09, 2023 10:24 pm
Posts: 12
I have a bunch of these and don't know whether to throw them in high peripheral or if they may make something better. Any help would be appreciated. Thanks


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PostPosted: Fri May 08, 2026 5:09 pm 
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Joined: Mon Apr 15, 2024 9:38 pm
Posts: 528
Location: Western Pennsylvania
You should remove the shielding. That can help getting a better grade.
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PostPosted: Fri May 08, 2026 6:51 pm 

Joined: Sat Nov 29, 2014 9:44 pm
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Location: I'm right here :D
I'm not sure that's shielding my whiskered friend.

High telco seems like a possibility but not 100% on that

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PostPosted: Fri May 08, 2026 7:06 pm 
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Location: Western Pennsylvania
Its a module. That metal on it should be able to be removed easily. Its a high frequency module probably a ceramic substrate with components on it. The gold underneath it. On the PCBs opposite side is a give away. It's high frequency circuitry underneath. And. A shield on top. That type of shielding is necessary for circuit stability.
So as is. Not removing the metal. I would evaluate at High Peripheral. I am curious to see what is under the shielding.
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PostPosted: Fri May 08, 2026 7:13 pm 

Joined: Sat Nov 29, 2014 9:44 pm
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¯\_(ツ)_/¯

It's a tough angle.

More pics please?

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PostPosted: Fri May 08, 2026 9:09 pm 
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Joined: Thu Jul 20, 2023 8:30 pm
Posts: 422
Location: Ohio
could be a cap, looks like a shield too. probably telco regardless


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PostPosted: Sat May 09, 2026 12:07 pm 

Joined: Fri Dec 20, 2019 3:16 am
Posts: 495
Location: Ohio
It is capped but it does look like its solder to the chip. The cap will be removeable if you see a slight edge above the chip. Take a small flathead or something small enough to fit that hole and pull up. You will know if it can be removed or not.

Low tel at the least most likely High tel.

Side note: make sure to remove most, if not entirely, thermal pastes and sticky tacks/adhesives on top of those chips.


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